Editorial Board

Honorary Editor-in-Chief
Songlin ZHUANG, University of Shanghai for Science and Technology, China

Editors-in-Chief
Min GU, University of Shanghai for Science and Technology, China
Min QIU, Westlake University, China

Associate Editors-in-Chief
Hongbo SUN, Tsinghua University, China
Cheng-Wei QIU, National University of Singapore, Singapore
Xiaoyi BAO, University of Ottawa, Canada
Qiwen ZHAN, University of Shanghai for Science and Technology, China
Weili ZHANG, Oklahoma State University, USA
Winnie Ye, Carleton University, Canada
Yi LUO, Tsinghua University, China

Managing Editor
Ziyang ZHANG, Westlake University, China

Topical Editors
Alexander Shkurinov, Lomonosov Moscow State Unviversity, Russia
Chaoyang LU, University of Science and Technology of China, China
Christos Kouloumentas, National Technical University of Athens, Greece
Chao ZUO, Nanjing University of Science and Technology, China
Dawei ZHANG, University of Shanghai for Science and Technology, China
Dong LIU, Zhejiang University, China
Greg Gbur, University of North Carolina at Charlotte, USA
Jianpu WANG, Nanjing Tech University, China
Jianwen DONG, Sun Yat-sen University, China
Joel Yang, Singapore University of Technology and Design , Singapore
Junsuk Rho, Pohang University of Science & Technology (POSTECH), Korea
Lan LI, Westlake University, China
Liangcai CAO, Tsinghua University, China
Ling FU, Huazhong University of Science and Technology, China
Lingling HUANG, Beijing Institute of Technology, China
Meng CUI, Purdue University, USA
Minglie HU, Tianjin University, China
Pu ZHOU, National University of Defense Technology, China
Qiaoqiang GAN, University of Buffalo, USA
Qiming ZHANG, University of Shanghai for Science and Technology, China
Qing DAI, The National Center for Nanoscience and Technology, China
Qing YANG, Zhejiang University, China
Ravi Bhardwaj, University of Ottawa, Canada
Shilong PAN, Nanjing University of Aeronautics and Astronautics, China
Shumin XIAO, Harbin Institute of Technology, China
Tao CHU, Zhejiang University, China
Ranjan Singh, Nanyang Technological University, Singapore
Xi CHEN, University of Shanghai for Science and Technology, China
Xianmin JIN, Shanghai Jiao Tong University, China
Xiaofeng LI, Soochow University, China
Yangjian CAI, Shandong Normal University, China
Yao HE, Soochow University, China
Yan PENG, University of Shanghai for Science and Technology, China
Yiming ZHU, University of Shanghai for Science and Technology, China
Ying GU, Peking University, China
Yongmin LIU, Northeastern University, USA
Yujie SUN, Peking University, China
Zhaohui LI, Sun Yat-sen University, China
Ziyang ZHANG, Westlake University, China

Editorial Board Members
Andrew Forbes, University of the Witwatersrand, South Africa
Byoungho Lee, Seoul National University, Korea
Ben Zhong TANG, South China University of Technology/The Hong Kong University of Science and Technology, China
Chongjin XIE, Alibaba Group, China
Daniel Jaque, Universidad Autónoma de Madrid, Spain
Dongling MA, National Institute of Scientific Research, Center for Energy, Materials, and Telecommunications (INRS-EMT), Canada
Dragomir Neshev, Australian National University, Australia
Eli Yablonovitch, University of California, Berkeley, USA
JingHua TENG, Institute of Materials Research and Engineering (IMRE) , Singapore
Kazuhiko Hirakawa, The University of Tokyo, Japan
Qing HU, Massachusetts Institute of Technology, USA
Qingming LUO, Hainan University, China
Qionghua WANG, Beihang University, China
Satoshi Kawata, Osaka University, Japan
Saulius Juodkazis, Swinburne University of Technology, Australia
Siddharth Ramachandran, Boston University, USA
Taco D. Visser, Vrije Universiteit Amsterdam, Netherlands
Tiejun CUI, Southeast University, China
Wolfgang Osten, Univ. of Stuttgart, Germany
Xiang LIU, HUAWEI R&D USA, China
Xiaocong YUAN, Shenzhen University, China
Xuelong LI, Northwestern Polytechnical University, China
Ying GU, The General Hospital of the People's Liberation Army, China